|
Property |
G10 Glass/Epoxy |
|
Physical |
|
|
Specific Gravity |
1.8 |
|
Moisture Absorption |
0.15% |
|
Dimensional Stability, E-2/150 |
<0.04% Warp - Fill |
|
Dimensional Stability, E-2/150 |
<1.00% Bow - Twist |
|
Mechanical |
|
|
Rockwell Hardness (.062") |
0.15% |
|
Flexural Strength (.062") LW |
70,000 psi |
|
Flexural Strength (.062")CW |
60,000 psi |
|
Flexural Modulus (.062") LW |
2,700,000 psi |
|
Flexural Modulus (.062")CW |
2,400,000 psi |
|
Tensile Strength (.125") LW |
45,000 psi |
|
Tensile Strength (.125") CW |
38,000 psi |
|
Izod Impact Strength E-48/50 (.500") LW |
14.0 ft-lb/in |
|
Izod Impact Strength E-48/50 (.500") CW |
12.0 ft-lb/in |
|
Compressive Strength Flatwise (.500") |
55,000 psi |
|
Bond Strength (.500") |
2,200 lbs |
|
Shear Strength (Perpendicular)(.062) |
22,000 psi |
|
Thermal |
|
|
Maximum Operating Temperature |
284 oF |
|
Coefficient of Thermal Expansion (.062")
X-Axis |
5.5 x 10^-6 (in/in/oF) |
|
Flammability, Classification UL94 |
V0 |
|
Peel Strength After Thermal Stress |
11 lb./in After 10s/288 Deg.
oC |
|
Resistivity After Damp Heat Volume |
10 ^8 M ohms cm |
|
Resistivity After Damp Heat Surface |
10 ^8 M ohms |
|
Coefficient of Thermal Expansion (.062")
Y-Axis |
6.6 x 10^-6 (in/in/oF) |
|
Thermal Stress, Solder bath 288 deg. |
>60 oC |
|
Flammability Rating - U.L. 94 |
V-0 |
|
Glass Transition Temperature |
135 oC |
|
Temperature Index |
130 oC |
|
Electrical |
|
|
Arc Resistance |
125 s |
|
Dielectric Breakdown. Parallel to
laminate |
>60KV |
|
Dielectric Constant @ 1MHz |
4.7 |
|
Permittivity (.062") Condition D-24/23 |
4.8 |
|
Dissipation Factor (.062") Condition
D-24/23 |
0.025 |
|
Breakdown Voltage Condition -A (.062")
D-48/50 |
65,000 V |
|
|
|
54,000 V |
|
Electric Strength Condition - A (.062”)
D-48/50 |
800 V/mil |
|
|
|
750 V/mil |
|
Arc Resistance (.125") D-495 |
100 sec |
|
Q-Resonance @ 1 MHz |
>75 |
|
Q-Resonance @ 50 MHz |
>95 |
|
Tg |
261 °F |
